| Lapisan | 1-2 Lapisan |
| Ketebalan Rampung | 16-134mil (0,4mm-3,4mm) |
| Maks. ukuran | 500mm * 1200mm |
| Ketebalan Tembaga | 35um, 70um, 1 nganti 10oZ |
| Min Line Jembar / Spasi | 4 mil (0,1 mm) |
| Min Rampung Ukuran bolongan | 0,95 mm |
| Min. Ukuran Bor | 1.00mm |
| Maks. Ukuran Bor | 6,5 mm |
| Rampung Toleransi Ukuran Lubang | ± 0,050 mm |
| Presisi Posisi Aperture | ± 0,076 mm |
| Ukuran SMT PAD Min | 0.4mm ± 0.1mm |
| Min.Solder Topeng PAD | 0,05 mm (2 mil) |
| Min.Solder Topeng Penutup | 0,05 mm (2 mil) |
| Ketebalan topeng solder | > 12um |
| Finishing lumahing | HAL, HAL Lead free, OSP, Immersion Gold, lsp |
| Ketebalan HAL | 5-12um |
| Ketebalan Emas Immersion | 1-3mil |
| Ketebalan Film OSP | ENTEK PLUS HT: 0.3-0.5um; F2: 0.15-0.3um |
| Outline Finishing | Nuntun & Punching; Presisi panyimpangan ± 0.10mm |
| Konduktivitas termal | 1,0 kanggo 12w / mk |
| FOB Port | Shenzhen |
| Ukuran Karton Ekspor L/W/H | Ukuran 36 x 26 x 25 cm |
| Lead Time | 3-7 dina |
| Unit saben Karton Ekspor | 5.0 |
| Bobot Karton Ekspor | 18 kg |